View PCA1673_38404.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
PCA167x series 32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
Product specification Supersedes data of 1997 Apr 22 File under Integrated Circuits, IC16 1998 Apr 03
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
FEATURES * 32 kHz oscillator, amplitude regulated with excellent frequency stability * High immunity of the oscillator to leakage currents * Very low current consumption; typically 150 nA * Stop function for accurate timing * Chopped motor pulses available * Power-on reset for fast testing * Various test modes for testing the mechanical parts of the watch and the IC. ORDERING INFORMATION TYPE NUMBER PCA1672U PCA1673U PCA1675U PCA1676U/10 PCA1677U Note PACKAGE(1) NAME - - - - - chip in tray chip in tray chip in tray chip on foil chip in tray DESCRIPTION GENERAL DESCRIPTION
PCA167x series
The PCA167x series devices are CMOS integrated circuits specially suited for battery-operated, quartz-crystal-controlled wrist-watches, with a bipolar stepping motor.
VERSION - - - - -
1. Figure 1 and Chapter "Package outline" show details of standard package, available for large orders only. Chapter "Chip dimensions and bonding pad locations" shows exact pad locations for other delivery formats. PINNING SYMBOL VSS TEST OSC IN OSC OUT VDD M1 M2 RESET PIN 1 2 3 4 5 6 7 8 DESCRIPTION ground (0 V) test output oscillator input oscillator output positive supply voltage motor 1 output motor 2 output reset input
VSS TEST OSC IN OSC OUT 1 2 8 7 RESET M2 M1 V DD
PCA167xT
3 4
MSA978
6 5
Fig.1 Pin configuration, PCA167xT, (PMFP8).
1998 Apr 03
2
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
FUNCTIONAL DESCRIPTION AND TESTING Motor pulse The motor output pulse widths (tP) and the cycle times (tT) are given in Chapter "Available types". Power-on reset For correct operation of the Power-on reset the rise time of VDD from 0 V to 1.55 V should be less than 0.1 ms. All resettable flip-flops are reset. Additionally the polarity of the first motor pulse is positive: VM1 - VM2 0 V.
PCA167x series
Customer testing and stop mode An output frequency of 32 Hz is provided at RESET (pin 8) to be used for exact frequency measurement. Connecting the RESET to VDD stops the motor pulses leaving them in a HIGH impedance 3-state condition and a 32 Hz signal is produced at the TEST pin. A debounce circuit protects against accidental stoppages due to mechanical shock to the watch (tDEB = 14.7 to 123.2 ms). Connecting RESET to VSS activates the test mode. The motor pulse period is 31.25 ms instead of tT. Test and stop mode are disabled by disconnecting RESET (open-circuit).
AVAILABLE TYPES Refer to Fig.2 and to Chapters "Ordering information" and "Functional description and testing". SPECIFICATIONS SHORT TYPE NUMBER 1672 1673 1675 1676 1677 Note 1. U = Chip in trays; U/10 = chip on foil. DELIVERY FORMAT(1) U U U U/10 U PERIOD tT (s) 1 1 1/16 10 10 PULSE WIDTH tP (ms) 7.8 5.8 5.8 5.8 7.8 DRIVE (%) 56 56 100 56 100 EEPROM no no no no no BATTERY EOL DETECTION no no no no no REMARKS 3 V Lithium 3 V Lithium no oscillator 3 V Lithium 1.5 V
V M1 - M2
tT 2t T
MSA977
tP
Fig.2 Motor output waveform (normal operation).
1998 Apr 03
3
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VDD VI Tamb Tstg Note PARAMETER supply voltage all input voltages output short-circuit duration operating ambient temperature storage temperature -10 -30 CONDITIONS VSS = 0 V; note 1 VSS MIN. -1.8
PCA167x series
MAX. +6 VDD indefinite +60 +100 C C V V
UNIT
1. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows, which will rapidly discharge the battery. HANDLING Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is advisable to take handling precautions appropriate to handling MOS devices. Advice can be found in "Data Handbook IC16, General, Handling MOS Devices". CHARACTERISTICS VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 C; crystal: RS = 20 k; C1 = 2 to 3 fF; CL = 8 to 10 pF; C0 = 1 to 3 pF; unless otherwise specified. SYMBOL Supply VDD VDD IDD1 IDD2 IDD3 IDD4 supply voltage supply voltage variation supply current supply current supply current supply current Tamb = -10 to +60 C transient; VDD = 1.2 to 3.5 V between motor pulses between motor pulses; VDD = 3.5 V stop mode; pin 8 connected to VDD stop mode; pin 8 connected to VDD; VDD = 3.5 V 1.2 - - - - - 1.5 - 150 200 180 300 3.5 0.25 250 350 300 480 V V nA nA nA nA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1998 Apr 03
4
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
SYMBOL Motor output Vsat Rsc tT tP Oscillator VOSC ST gm tosc f/f Ci Co Reset input fo Vo tedge Iim Ii(av) Test mode tT1 tDEB Notes cycle time debounce time RESET = VDD - 14.7 31.25 - output frequency output voltage swing edge time peak input current average input current R = 1 M; C = 10 pF R = 1 M; C = 10 pF note 3 - 1.4 - - - 32 - 1 320 10 starting voltage transconductance start-up time frequency stability input capacitance output capacitance VDD = 100 mV Vi(p-p) = 50 mV 1.2 6 - - - 19 - 15 1 0.05 x 3 24 saturation voltage (P + N) short-circuit resistance (P + N) cycle time pulse width RL = 2 k; Tamb = -10 to +60 C Itransistor < 1 mA - - 150 200 PARAMETER CONDITIONS MIN.
PCA167x series
TYP.
MAX.
UNIT
200 300 note 1 note 2 - - - 10-6 0.3 x - 29 - - - - - - 123.2 10-6
mV
V S s pF pF
Hz V s nA nA
ms ms
1. Cycle time can be changed to one of the following values: 1, 5, 10, 12 or 20 s (see Chapter "Available types"). 2. Pulse width can be varied from 2 ms to 15.7 ms in steps of 1 ms (see Chapter "Available types"). 3. Duty factor is 1 : 32 and RESET = VDD or VSS.
1998 Apr 03
5
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
CHIP DIMENSIONS AND BONDING PAD LOCATIONS
PCA167x series
y OSC OUT OSC IN TEST
V SS
1.44 mm
PCA167xU SERIES
0 0 VDD M1 2.02 mm
MSA979
x M2 RESET
Chip area: 2.91 mm2. Bonding pad dimensions: 110 m x 110 m. Chip thickness: 200 25 m, with bumps: 270 25 m.
Fig.3 Bonding pad locations, PCA167xU series; 8 terminals. Table 1 Bonding pad locations (dimensions in m) All x/y coordinates are referenced to the centre of pad (VDD), see Fig.3. PAD VSS TEST OSC IN OSC OUT VDD M1 M2 RESET chip corner (max. value) x 1290 940 481 -102 0 578 930 1290 -497.5 y 1100 1100 1100 1100 0 0 0 0 -170
1998 Apr 03
6
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
APPLICATION INFORMATION
PCA167x series
1.55 V
VSS
1
8
RESET
TEST CT 15 pF
(1)
2
7
M2
M
OSC IN
PCA167x SERIES
3 6
M1
OSC OUT
4
5
VDD
MSA980
(1) Quartz crystal case should be connected to VDD. Stray capacitance and leakage resistance from RESET, M1 or M2 to OSC IN should be less than 0.5 pF or larger than 20 M.
Fig.4 Typical application circuit diagram.
1998 Apr 03
7
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
PACKAGE OUTLINE PMFP8: plastic micro flat package; 8 leads (straight)
PCA167x series
SOT144-1
D
E
X
m
c
t
n HE
8
5
Q2 A2 pin 1 index Q1 L detail X 1 e b 4 wM
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A2 0.90 0.70 b 0.40 0.25 c 0.19 0.12 D (1) 3.1 2.9 E (1) 3.1 2.9 e 0.80 HE 4.6 4.4 L 0.75 m max. 0.26 n max. 0.3 Q1 0.40 0.30 Q2 0.40 0.30 t 0.95 w 0.1
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT144-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 94-01-25 95-01-24
1998 Apr 03
8
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reflow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. Wave soldering
PCA167x series
Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Apr 03
9
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
PCA167x series
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1998 Apr 03
10
Philips Semiconductors
Product specification
32 kHz watch circuits using a silver-oxide or a 3 V lithium battery
NOTES
PCA167x series
1998 Apr 03
11
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
415108/1200/03/pp12
Date of release: 1998 Apr 03
Document order number:
9397 750 03604

▲Up To Search▲

Price & Availability of PCA1673

	To Download PCA1673 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .